AOS
MOSFETs, power-management ICs and DC/DC converters
About the manufacturer
Alpha and Omega Semiconductor (AOS) is a global supplier of power semiconductors and power-management solutions. The company designs and supplies a broad range of discrete devices, integrated circuits and modules for modern power systems.
The AOS portfolio includes Power MOSFETs, IGBTs, SiC and GaN devices, IPMs, TVS products, high-voltage gate drivers, Power ICs and Digital Power solutions. The company combines semiconductor process development, IC design and advanced packaging to reduce power losses and increase power density.
AOS products target high-volume applications including PCs, graphics cards, data centres and AI servers, smartphones, motor controls, TVs, lighting, automotive electronics and power supplies.
Applications
AOS components are primarily used in systems that require high energy efficiency and precise power control.
- DC/DC converters – voltage regulation and step-down conversion
- servers and data centres – power delivery for CPUs, GPUs and compute modules
- PC and consumer electronics – motherboard and mobile-device power rails
- automation and drives – motor and inductive-load control
- automotive electronics – power conversion and load switching
- power supplies – switching and power regulation
- LED lighting – power conversion and stabilization
AOS products available from Maritex
The AOS range available from Maritex includes power-management ICs and semiconductors for converters and power systems. Available solutions include integrated DC/DC converters from the AOZ family.
Available product groups include:
- buck DC/DC converters
- switching regulators
- power-management ICs (PMICs)
- power semiconductors and switching devices
Examples include AOZ1282DI, AOZ1284PI and AOZ6605PI-1. These step-down converters are designed to reduce and regulate supply voltages in digital, industrial and consumer electronics.
When choosing a device, match the input and output voltage range, maximum current, switching frequency, efficiency, required external components, package type and thermal conditions.
