BOYD
Heat sinks and thermal-management solutions for power electronics
About the manufacturer
BOYD is a global brand associated with advanced engineered materials, device protection and thermal management. In electronics cooling, the Aavid Thermalloy heritage is particularly important: Aavid has long been known for heat sinks and engineered thermal solutions for semiconductors and electronic systems. Aavid was acquired by Boyd in 2017, and Boyd Thermal was sold to Eaton in 2026 and is now part of Eaton.
Thermal technologies developed under the Boyd/Aavid name include conventional aluminum heat sinks, conduction cooling, heat pipes, vapor chambers, heat exchangers, cold plates and liquid-cooling systems. Their purpose is to remove heat from semiconductors, power modules, processors, converters and other components whose temperature directly affects reliability and service life.
Even a simple heat sink must be matched correctly to the device package, power dissipation, airflow and allowable junction temperature. For this reason, the Boyd/Aavid portfolio includes many geometries, materials and mounting options for common semiconductor packages and electronic modules.
Applications
Boyd/Aavid solutions are used where effective heat removal is essential for stability, efficiency and long-term reliability. Typical applications include:
- Power supplies and converters – cooling power transistors, rectifiers and regulators.
- Industrial automation – controllers, inverters, drives and power modules.
- Power electronics – IGBTs, MOSFETs and other high-dissipation devices.
- Computers and embedded systems – cooling processors, BGA devices and edge-computing hardware.
- Telecommunications and networking – thermal management of transmission and networking equipment.
- E-mobility and energy storage – cooling converters, chargers and battery electronics.
- Medical and measurement equipment – thermal stabilization in high-reliability systems.
BOYD products available from Maritex
The BOYD – AAVID THERMALLOY range at Maritex primarily includes heat sinks for passive cooling of semiconductor devices and electronic assemblies.
Available product groups include:
- Heat sinks for TO-220 and TO-262 packages.
- Heat sinks for TO-218 and TO-247 packages.
- Heat sinks for BGA devices.
- Heat sinks for D-Pak / TO-252 and D2PAK / TO-263 packages.
- Anodized aluminum heat sinks in multiple sizes and geometries.
- Cooling elements for single and dual power-device mounting.
The range includes, among others, the 576802B03900G for TO-220/TO-262, the 504222B00000G for TO-220 and the 529901B02500G for TO-218/TO-247, together with BGA heat sinks. The variety of formats makes it possible to match the cooling element to package size, required heat-dissipation area and mounting method.
Heat-sink selection should consider thermal resistance, device power dissipation, ambient temperature, semiconductor package, available airflow and whether a thermal-interface material is required between the component and heat sink.
