ESKA
Fuses, overcurrent protection and circuit protection components
About the manufacturer
ESKA Erich Schweizer GmbH is a German manufacturer specializing in electrical and electronic protection. Based in Kassel, the company develops solutions that protect devices, installations and power circuits against overloads, short circuits and excessive temperature. ESKA positions itself as a supplier of a broad range of fuses and passive protection components for industrial, automotive, energy and electronic applications.
Its portfolio includes cartridge, subminiature, SMD/SMT and chip fuses, automotive, power, photovoltaic and NH fuses, as well as resettable PTC devices, fuse holders and thermal protection components. ESKA supplies both standard catalogue products and customized solutions, allowing designers to match tripping characteristics, rated current, voltage and mechanical format to the application.
A key part of the range is intended for modern high-density electronics. Miniature SMD fuses reduce PCB footprint, while cartridge and power fuses address applications that require higher breaking capacity or current handling. ESKA also offers thermal cutoffs and temperature switches for protection against overheating.
Applications
ESKA products are used wherever a circuit must be disconnected quickly and predictably in the event of overload, short circuit or excessive temperature.
ESKA products available from Maritex
The ESKA offer from Maritex includes circuit-protection components designed to protect electronic circuits against excessive current. The range includes miniature SMD fuses for direct PCB assembly.
Available product groups include:
One example is FUSE 0603-FF PW 3A0, a very-fast-acting 3 A / 32 V DC SMD fuse in a 0603 package. Components of this type are well suited to compact electronic modules, power supplies, battery-powered devices and circuits that require a rapid response to overload. Selection should take into account rated current and voltage, time-current characteristic, breaking capacity, package format and the thermal conditions of the application