FISCHER ELEKTRONIK
Heatsinks, enclosures, mechanical components and thermal-management solutions
About the manufacturer
Fischer Elektronik is a German manufacturer specializing in thermal-management and mechanical solutions for electronics. The company is widely associated with heatsinks, aluminium profiles, enclosures, semiconductor mounting hardware and accessories used to build and cool electronic assemblies. Its products address the mechanical side of electronic design, where effective heat dissipation and reliable component mounting directly affect equipment lifetime and operating stability.
The portfolio covers board-level heatsinks, extruded cooling profiles, housings, PCB accessories and mounting elements for power semiconductors and electronic modules. A broad choice of geometries allows engineers to adapt the cooling surface, profile dimensions and installation method to the available enclosure space. Many solutions are designed for both natural convection and forced-air cooling, making them suitable for everything from compact control boards to higher-power converters.
Fischer Elektronik components are selected as part of the complete thermal path from the semiconductor junction to ambient air. Heatsink thermal resistance, contact surface, interface material, mounting pressure, orientation and airflow all influence the final junction temperature. The company’s mechanical and thermal portfolio is therefore especially useful in industrial electronics, power supplies, embedded systems, telecommunications equipment, LED power modules and prototypes that require a professional enclosure or cooling solution.
Applications
Fischer Elektronik products are mainly used in designs where temperature, enclosure mechanics and reliable mounting directly affect equipment lifetime.
FISCHER ELEKTRONIK products available from Maritex
The Fischer Elektronik range available from Maritex focuses on mechanical components and solutions supporting electronics cooling.
Available product groups include:
When selecting a heatsink or profile, thermal resistance, heat-dissipation area, mounting method and available airflow should be considered.
For thermal components, calculate the required thermal resistance from the power loss and allowed temperature rise, then check profile dimensions, mounting orientation, airflow, interface material and mechanical compatibility.