Accessories

Items per page:
Expansion board M.2 -> dual SATA III RAID Module; oper. temperature: 0+70 deg.C
Expansion board M.2 -> dual SATA III RAID Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EGSS-32R2
Manufacturer: INNODISK
Expansion board PCIe -> four isolated GbE LAN Module; oper. temperature: 0+70 deg.C
Expansion board PCIe -> four isolated GbE LAN Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: ELPL-G401
Manufacturer: INNODISK
Expansion board PCIex1 -> mPCIe Module; oper. temperature:-40+85 deg.C
Expansion board PCIex1 -> mPCIe Module; oper. temperature:-40+85 deg.C
cad-link
Manufacturer code: ELPP-0101
Manufacturer: INNODISK
Expansion board mPCIe -> dual isolated CANbus; oper. temperature: -40+85 deg.C
Expansion board mPCIe -> dual isolated CANbus; oper. temperature: -40+85 deg.C
cad-link
Manufacturer code: EMPC-B2S1
Manufacturer: INNODISK
Expansion board mPCIe -> single 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> single 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-21N1
Manufacturer: INNODISK
Expansion board mPCIe -> single Isolated 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> single Isolated 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-21S1
Manufacturer: INNODISK
Expansion board mPCIe -> single Isolated 2.5GbE LAN Horizontal Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> single Isolated 2.5GbE LAN Horizontal Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-21S2
Manufacturer: INNODISK
Expansion board mPCIe -> dual 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-22N1
Manufacturer: INNODISK
Expansion board mPCIe -> dual Isolated 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual Isolated 2.5GbE LAN Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-22S1
Manufacturer: INNODISK
Expansion board mPCIe -> dual Isolated 2.5GbE LAN Horizontal Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-22S2
Manufacturer: INNODISK
Expansion board mPCIe -> single GbE LAN; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> single GbE LAN; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G101
Manufacturer: INNODISK
Expansion board mPCIe -> single isolated GbE LAN horizontal Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> single isolated GbE LAN horizontal Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G102
Manufacturer: INNODISK
Expansion board mPCIe -> single GbE LAN; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G103
Manufacturer: INNODISK
Expansion board mPCIe -> dual GbE LAN; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual GbE LAN; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G201
Manufacturer: INNODISK
Expansion board mPCIe -> dual isolated GbE LAN horizontal Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual isolated GbE LAN horizontal Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G202
Manufacturer: INNODISK
Expansion board mPCIe -> dual GbE LAN ; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual GbE LAN ; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G203
Manufacturer: INNODISK
Expansion board mPCIe -> dual GbE LAN; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual GbE LAN; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G2N1
Manufacturer: INNODISK
Expansion board mPCIe -> dual PoE Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual PoE Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G2P1
Manufacturer: INNODISK
Expansion board mPCIe -> dual PoE+ Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual PoE+ Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G2P2
Manufacturer: INNODISK
Expansion board mPCIe -> dual PoE module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual PoE module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G2P3
Manufacturer: INNODISK
Expansion board mPCIe -> dual PoE+ module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual PoE+ module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G2P4
Manufacturer: INNODISK
Expansion board mPCIe -> dual isolated GbE LAN; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G2S1
Manufacturer: INNODISK
Expansion board mPCIe -> dual isolated GbE LAN; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual isolated GbE LAN; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPL-G2S2
Manufacturer: INNODISK
Expansion board mPCIe -> dual SATA III RAID Module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual SATA III RAID Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPS-32R1
Manufacturer: INNODISK
Expansion board M.2 -> dual USB 3.0 Module; oper. temperature: 0+70 deg.C
Expansion board M.2 -> dual USB 3.0 Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPU-3201
Manufacturer: INNODISK
Expansion board M.2 -> 2 porty USB; oper. temperature: 0+70 deg.C
Expansion board M.2 -> 2 porty USB; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPU-3401
Manufacturer: INNODISK
Expansion board mPCIe -> dual VGA and HDMI (or DVI) module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> dual VGA and HDMI (or DVI) module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPV-1201
Manufacturer: INNODISK
Expansion board mPCIe -> VGA and LVDS module; oper. temperature: 0+70 deg.C
Expansion board mPCIe -> VGA and LVDS module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EMPV-1202
Manufacturer: INNODISK
Expansion board mPCIe -> dual isolated CAN 2.0B/J1939/CANopen; oper. temperature: -40+85 deg.C
Expansion board mPCIe -> dual isolated CAN 2.0B/J1939/CANopen; oper. temperature: -40+85 deg.C
cad-link
Manufacturer code: EMUC-B2S3
Manufacturer: INNODISK
Expansion board mPCIe -> M.2 A-E key Module; oper. temperature: -40+85 deg.C
Expansion board mPCIe -> M.2 A-E key Module; oper. temperature: -40+85 deg.C
cad-link
Manufacturer code: EMXX-0101
Manufacturer: INNODISK
Expansion board mPCIe -> M.2 B key Module; oper. temperature: -40+85 deg.C
Expansion board mPCIe -> M.2 B key Module; oper. temperature: -40+85 deg.C
cad-link
Manufacturer code: EMXX-0102
Manufacturer: INNODISK
PCIe x4 4GbE LAN module
cad-link
Manufacturer code: ESPL-G401
Manufacturer: INNODISK
Expansion board PCIe -> four PoE/PoE+ module; oper. temperature: 0+70 deg.C
Expansion board PCIe -> four PoE/PoE+ module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: ESPL-G4P1
Manufacturer: INNODISK
Expansion board PCIe -> four PoE/PoE+ module; oper. temperature: 0+70 deg.C
Expansion board PCIe -> four PoE/PoE+ module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: ESPL-G4P3
Manufacturer: INNODISK
MIPI fixed focus camera module; fisheye; 1920x1200; Nvidia Jetson Nano platform
cad-link
Manufacturer code: EV2M-GOM1
Manufacturer: INNODISK
MIPI fixed focus camera module; 1920x1200; Nvidia Jetson Xavier NX/Nano platform
cad-link
Manufacturer code: EV2M-OOM1
Manufacturer: INNODISK
USB2.0 fixed focus camera module; 1920x1080; HDR
cad-link
Manufacturer code: EV2U-RMR1
Manufacturer: INNODISK
USB2.0 fixed focus camera module; 1920x1080; HDR
cad-link
Manufacturer code: EV2U-RMR2
Manufacturer: INNODISK
USB2.0 fixed focus camera module; 1920x1080; low light
cad-link
Manufacturer code: EV2U-SGR1
Manufacturer: INNODISK
USB2.0 Fixed Focus Camera Module; 4192 x 3120; oper. temperature: -30+70 deg.C
USB2.0 Fixed Focus Camera Module; 4192 x 3120; oper. temperature: -30+70 deg.C
cad-link
Manufacturer code: EV5U-RGR1
Manufacturer: INNODISK
MIPI Fixed Focus Camera Module; 4192 x 3120; oper. temperature: -30+70 deg.C
MIPI Fixed Focus Camera Module; 4192 x 3120; oper. temperature: -30+70 deg.C
cad-link
Manufacturer code: EVDM-OOM1
Manufacturer: INNODISK
Machine vision module; AMD Xilinx Kria K26 platform; 1x HDMI; 1x LAN; 4x USB; oper. temperature: 0+70 deg.C
Machine vision module; AMD Xilinx Kria K26 platform; 1x HDMI; 1x LAN; 4x USB; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EXMU-X261
Manufacturer: INNODISK
Expansion board PCIe -> four PoE/PoE+ Module; oper. temperature: 0+70 deg.C
Expansion board PCIe -> four PoE/PoE+ Module; oper. temperature: 0+70 deg.C
cad-link
Manufacturer code: EXOU-X261
Manufacturer: INNODISK
Expansion board CFast -> SATA III Module; oper. temperature: -40+85 deg.C
Expansion board CFast -> SATA III Module; oper. temperature: -40+85 deg.C
cad-link
Manufacturer code: EZSS-0101
Manufacturer: INNODISK
Expansion board USB -> I2C Sensor Carrier Board; oper. temperature: -40+85 deg.C
Expansion board USB -> I2C Sensor Carrier Board; oper. temperature: -40+85 deg.C
cad-link
Manufacturer code: EZU2-I301
Manufacturer: INNODISK
Mounting bracket for 2.5-inch devices in a 3.5-inch bay
Mounting bracket for 2.5-inch devices in a 3.5-inch bay
Manufacturer code: Delock 18105
Quantity
pcs.
Net price
PLN/pcs.
1+ 21.10
2
items in stock
Quantity
Total 21,10 PLN net
Expansion board LAN-> 2x CANbus 2.0B; oper. temperature: -10+85 deg.C
Expansion board LAN-> 2x CANbus 2.0B; oper. temperature: -10+85 deg.C
cad-link
Manufacturer code: InnoEx-ETC22
Manufacturer: INNODISK
Expansion board LAN-> 3xUSB/1xHDMI; oper. temperature: -10+85 deg.C
Expansion board LAN-> 3xUSB/1xHDMI; oper. temperature: -10+85 deg.C
cad-link
Manufacturer code: InnoEx-IPCKVM
Manufacturer: INNODISK
AudioCable; 45cm;Connector pitch 2.00mm; 59384500100E
AudioCable; 45cm;Connector pitch 2.00mm; 59384500100E
cad-link
Manufacturer code: 59384500100E
Manufacturer: AXIOMTEK
Quantity
pcs.
Net price
PLN/pcs.
1+ 17.25
3
items in stock
Quantity
Total 17,25 PLN net
59903000000E, power cord
59903000000E, power cord
cad-link
Manufacturer code: 59903000000E
Manufacturer: AXIOMTEK
Quantity
pcs.
Net price
PLN/pcs.
1+ 5.40
2
items in stock
Quantity
Total 5,40 PLN net
contact