contact Call us: +48 58 6228900
en
en PL PLN net
European Union
European Union
Manufacturers Manufacturers
Products Products
Products
Semiconductors
Sensors
Wireless communication
LEDs
Displays
Passive components
Connectors
Relays, contactors
Switches
Power supplies
Industrial automation
Acoustics
Cooling solutions: fans, heatsinks
Mechanical
Printed circuit boards
Cables, wires for electronics
Tools and technical equipment
Accessories
Circuit and Installation Protection
New Products
All Categories
Manufacturers

Microcontrollers

Items per page:
LPC1822JET100E
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1822JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
LPC1823JBD144E
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1823JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
LPC1823JET100E
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1823JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
LPC1825JBD144E
Microcontroller; 768kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1825JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
LPC1827JBD144E
Microcontroller; 1MB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1827JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
LPC1830FBD144,551
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1830FBD144,551
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
LPC1830FET100,551
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1830FET100,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
LPC1830FET180,551
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1830FET180,551
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
LPC1830FET256,551
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1830FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
LPC1830FET256K-U1
Application Processors & System-on-Chip (SoC); LPC1830FET256K; NXP SEMICONDUCTORS
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1830FET256K
Manufacturer: NXP
Quantity
pcs. 		Net price
PLN/pcs.
1+ 86.45
10+ 75.59
50+ 67.72
100+ 62.65
450+ 55.03
For business clients only
450
delivery 4-10 days
Check lead times
Quantity per package: 450
Type of packaging: tray
LPC1833FET256,551
Microcontroller; 512kB Flash; 32bit; Vin 2-3.6V; -40+85 deg.C; LBGA256
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1833FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
LPC1833JBD144E
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC1833JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
contact