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Microcontrollers

Items per page:
LPC18S10FBD144E
Microcontroller; 136kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S10FBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
LPC18S10FET100E
Microcontroller; 136kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; TFBGA100
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S10FET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
LPC18S30FBD144E
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S30FBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
LPC18S30FET100E
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; TFBGA100
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S30FET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
LPC18S30FET256E
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LBGA256
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S30FET256E
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
LPC18S37JBD144E
Microcontroller; 1MB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S37JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
LPC18S37JET100E
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S37JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
LPC18S50FET180E
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; TFBGA180
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S50FET180E
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
LPC18S50FET256,551
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LBGA256
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S50FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
LPC18S57JBD208E
Microcontroller; 1MB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP208
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S57JBD208E
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
LPC18S57JET256E-U1
Microcontrollers (MCU); LPC18S57JET256E; NXP SEMICONDUCTORS; 136 kB; 180 MHz; 164; 1 MB
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC18S57JET256E
Manufacturer: NXP
Quantity
pcs. 		Net price
PLN/pcs.
1+ 138.96
10+ 113.64
30+ 99.34
50+ 90.26
90+ 84.78
Quantity per package: 90
Type of packaging: tray
LPC2119FBD64/01-U1
Microcontrollers (MCU); LPC2119FBD64/01; NXP SEMICONDUCTORS; 16 kB; 60 MHz; 46; 128 kB
Product card pdf-icon PDF
cad-link
Manufacturer code: LPC2119FBD64/01
Manufacturer: NXP
Quantity
pcs. 		Net price
PLN/pcs.
1+ 69.00
10+ 53.47
30+ 42.63
100+ 33.13
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