Microcontrollers
Items per page:
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Manufacturer code: LPC1833JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC1833JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC1837FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontrollers (MCU); LPC1837JBD144E; NXP SEMICONDUCTORS; 136 kB; 180 MHz; 83; 1 MB
Manufacturer code: LPC1837JBD144E
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 111.61 |
| 10+ | 91.84 |
| 30+ | 80.97 |
| 60+ | 74.29 |
Quantity per package:
60
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC1837JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC1837JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontrollers (MCU); LPC1850FET256,551; NXP SEMICONDUCTORS; 200 kB; 180 MHz; 164; 128 B
Manufacturer code: LPC1850FET256,551
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 83.99 |
| 10+ | 62.43 |
| 50+ | 54.21 |
Quantity per package:
90
Type of packaging:
reel
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP208
Manufacturer code: LPC1853JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC1853JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC1857FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontrollers (MCU); LPC1857JBD208E; NXP SEMICONDUCTORS; 136 kB; 180 MHz; 142; 1 MB
Manufacturer code: LPC1857JBD208E
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 105.18 |
| 10+ | 74.02 |
Quantity per package:
36
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC1857JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 136kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC18S10FBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 136kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC18S10FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC18S30FBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC18S30FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC18S30FET256E
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC18S37JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC18S37JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; TFBGA180
Manufacturer code: LPC18S50FET180E
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 200kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC18S50FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP208
Manufacturer code: LPC18S57JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontrollers (MCU); LPC18S57JET256E; NXP SEMICONDUCTORS; 136 kB; 180 MHz; 164; 1 MB
Manufacturer code: LPC18S57JET256E
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 138.96 |
| 10+ | 113.64 |
| 30+ | 99.34 |
| 50+ | 90.26 |
| 90+ | 84.78 |
Quantity per package:
90
Type of packaging:
tray
Microcontrollers (MCU); LPC2119FBD64/01; NXP SEMICONDUCTORS; 16 kB; 60 MHz; 46; 128 kB
Manufacturer code: LPC2119FBD64/01
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 69.00 |
| 10+ | 53.47 |
| 30+ | 42.63 |
| 100+ | 33.13 |
Microcontrollers (MCU); LPC2132FBD64/01EL; NXP SEMICONDUCTORS
Manufacturer code: LPC2132FBD64/01EL
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 44.53 |
| 10+ | 34.51 |
| 30+ | 27.51 |
| 100+ | 21.38 |
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; -40+85 deg.C; LQFP64
Manufacturer code: LPC2136FBD64/01
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 32kB Flash; 32bit; -40+85 deg.C; LQFP64
Manufacturer code: LPC2141FBD64,151
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontrollers (MCU); LPC2144FBD64,151; NXP SEMICONDUCTORS; 16 kB
Manufacturer code: LPC2144FBD64,151
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 111.45 |
| 10+ | 99.60 |
| 25+ | 94.49 |
| 50+ | 90.39 |
| 100+ | 86.37 |
| 250+ | 80.97 |
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; -40+85 deg.C; LQFP64
Manufacturer code: LPC2146FBD64
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; -40+85 deg.C; LQFP144
Manufacturer code: LPC2214FBD144,551
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 128kB Flash; 32bit; -40+85 deg.C; LQFP100
Manufacturer code: LPC2362FBD100
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 128kB Flash; 32bit; -40+85 deg.C; LQFP100
Manufacturer code: LPC2364FBD100
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontrollers (MCU); LPC2364FBD100K; NXP SEMICONDUCTORS
Manufacturer code: LPC2364FBD100K
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 112.43 |
| 10+ | 70.74 |
| 25+ | 65.89 |
| 100+ | 60.99 |
| 250+ | 56.64 |
| 500+ | 52.65 |
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; -40+85 deg.C; LQFP100
Manufacturer code: LPC2366FBD100K
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; LQFP144
Manufacturer code: LPC2378FBD144K
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; LQFP100
Manufacturer code: LPC2387FBD100
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontrollers (MCU); LPC2388FBD144K; NXP SEMICONDUCTORS
Manufacturer code: LPC2388FBD144K
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 130.71 |
| 10+ | 113.06 |
| 25+ | 103.40 |
| 100+ | 90.11 |
Quantity per package:
300
Type of packaging:
tray
Microcontrollers (MCU); LPC2478FBD208K; NXP SEMICONDUCTORS
Manufacturer code: LPC2478FBD208K
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 120.12 |
| 10+ | 94.59 |
| 36+ | 81.51 |
| 108+ | 68.91 |
Quantity per package:
36
Type of packaging:
reel
Microcontrollers (MCU); LPC3250FET296/01K; NXP SEMICONDUCTORS
Manufacturer code: LPC3250FET296/01K
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 108.25 |
| 10+ | 90.66 |
| 25+ | 78.01 |
| 100+ | 68.94 |
Quantity per package:
630
Type of packaging:
tray
Microcontroller; 128kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP80
Manufacturer code: LPC4074FBD80,551
Manufacturer: NXP
Quantity per package:
595
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4076FBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; -40+85 deg.C; TFBGA180
Manufacturer code: LPC4076FET180,551
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontrollers (MCU); LPC4078FBD100K; NXP SEMICONDUCTORS
Manufacturer code: LPC4078FBD100K
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 73.15 |
| 10+ | 64.04 |
| 25+ | 55.63 |
| 100+ | 49.41 |
| 450+ | 45.69 |
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4078FBD144,551
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontrollers (MCU); LPC4078FBD208,551; NXP SEMICONDUCTORS; 96 kB; 120 MHz; 165; 512 kB
Manufacturer code: LPC4078FBD208,551
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 119.07 |
| 10+ | 88.97 |
| 25+ | 84.06 |
| 100+ | 77.57 |
| 250+ | 71.73 |
| 500+ | 66.49 |
Quantity per package:
36
Type of packaging:
reel
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP80
Manufacturer code: LPC4078FBD80,551
Manufacturer: NXP
Quantity per package:
595
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA180
Manufacturer code: LPC4078FET180,551
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA208
Manufacturer code: LPC4078FET208,551
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4088FBD144,551
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 120MHz; 32bit; 512kB; -40+85 deg.C; LQFP208
Manufacturer code: LPC4088FBD208
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
Manufacturer code: LPC4088FBD208,551
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA208
Manufacturer code: LPC4088FET208,551
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4310FET100,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4312JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4312JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4313JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4317JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4320FBD144,551
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4320FET100,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4322JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4322JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4323JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4327JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 264kB SRAM; 204MHz; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4330FBD144
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4330FBD144,551
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4330FET100,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
Manufacturer code: LPC4330FET180,551
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 16kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4330FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4333FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4333JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4333JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4337FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontrollers (MCU); LPC4337JBD144E; NXP SEMICONDUCTORS; 136 kB; 204 MHz; 83; 1 MB
Manufacturer code: LPC4337JBD144E
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 113.64 |
| 10+ | 99.33 |
| 25+ | 90.39 |
| 60+ | 83.93 |
| 120+ | 78.33 |
| 360+ | 70.40 |
Quantity per package:
60
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4337JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC4337JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4350FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; LQFP208
Manufacturer code: LPC4353JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4357FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontrollers (MCU); LPC4357JBD208K; NXP SEMICONDUCTORS
Manufacturer code: LPC4357JBD208K
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 127.79 |
| 10+ | 107.23 |
| 25+ | 94.33 |
| 100+ | 80.98 |
Quantity per package:
180
Type of packaging:
reel
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC4357JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4370FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4370FET256E
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC43S20FBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC43S30FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC43S37JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC43S37JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
Manufacturer code: LPC43S50FET180E
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontrollers (MCU); LPC43S57JET256E; NXP SEMICONDUCTORS; 136 kB; 204 MHz; 164; 1 MB
Manufacturer code: LPC43S57JET256E
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 113.68 |
| 10+ | 99.36 |
| 25+ | 92.52 |
| 100+ | 84.25 |
Quantity per package:
90
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; -40+105 deg.C; LBGA256
Manufacturer code: LPC43S67JET256E
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC43S70FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontrollers (MCU); LPC51U68JBD64EL; NXP SEMICONDUCTORS
Manufacturer code: LPC51U68JBD64EL
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 25.78 |
| 10+ | 22.18 |
| 30+ | 19.47 |
| 50+ | 18.54 |
| 100+ | 16.31 |
Quantity per package:
800
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; -40+105 deg.C; LQFP64
Manufacturer code: LPC51U68JBD64QL
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP100
Manufacturer code: LPC54005JBD100E
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC54005JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP100
Manufacturer code: LPC54016JBD100E
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP208
Manufacturer code: LPC54016JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA180
Manufacturer code: LPC54016JET180E
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP208
Manufacturer code: LPC54018JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 32kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA180
Manufacturer code: LPC54018JET180E
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; Vin 1.62-3.6V; -40+105 deg.C; LQFP64
Manufacturer code: LPC54101J256BD64QL
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray