Microcontrollers

Items per page:
Microcontroller; 256kB Flash; 32bit; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1765FET100K
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP100
cad-link
Manufacturer code: LPC1766FBD100
Manufacturer: NXP
Quantity per package: 450
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP100
cad-link
Manufacturer code: LPC1766FBD100K
Manufacturer: NXP
Quantity per package: 450
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP100
cad-link
Manufacturer code: LPC1767FBD100K
Manufacturer: NXP
Quantity per package: 450
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; LQFP100
cad-link
Manufacturer code: LPC1768FBD100K
Manufacturer: NXP
Quantity per package: 450
Type of packaging: tray
Microcontrollers (MCU); LPC1768FET100,551; NXP SEMICONDUCTORS; 64 kB; 100 MHz; 70; 512 kB
cad-link
Manufacturer code: LPC1768FET100,551
Manufacturer: NXP
Quantity
pcs.
Net price
PLN/pcs.
1+ 63.42
10+ 55.81
25+ 52.34
100+ 48.02
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1768FET100Y
Manufacturer: NXP
Quantity per package: 2000
Type of packaging: reel
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; WCLSP; -40+85 deg.C
cad-link
Manufacturer code: LPC1768UKZ
Manufacturer: NXP
Quantity per package: 260
Type of packaging: reel
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; LQFP100
cad-link
Manufacturer code: LPC1769FBD100K
Manufacturer: NXP
Quantity per package: 450
Type of packaging: tray
Microcontroller; 128kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC1774FBD144,551
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 128kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1774FBD208,551
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1776FBD208,551
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1776FBD208K
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; -40+85 deg.C; TFBGA180
cad-link
Manufacturer code: LPC1776FET180,551
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1777FBD208,551
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC1778FBD144K
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1778FBD208K
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA180
cad-link
Manufacturer code: LPC1778FET180,551
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA208
cad-link
Manufacturer code: LPC1778FET208K
Manufacturer: NXP
Quantity per package: 160
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1785FBD208,551
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1785FBD208K
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1786FBD208,551
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC1787FBD208,551
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC1788FBD144,551
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller LPC17xx; 32bit ARM CortexM3; 120MHz; FLASH 512kB; SRAM 96kB; USB; CAN; 2.4-3.6V; -40+85deg.C; LQFP208
Microcontroller LPC17xx; 32bit ARM CortexM3; 120MHz; FLASH 512kB; SRAM 96kB; USB; CAN; 2.4-3.6V; -40+85deg.C; LQFP208
cad-link
Manufacturer code: LPC1788FBD208,551
Manufacturer: NXP
Quantity per package: 36
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA180
cad-link
Manufacturer code: LPC1788FET180,551
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA208
cad-link
Manufacturer code: LPC1788FET208,551
Manufacturer: NXP
Quantity per package: 160
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1812JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1812JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1813JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1813JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 768kB Flash; 32bit; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1815JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 768kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1815JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1817JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1817JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 168kB SRAM; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC1820FBD144K
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1820FET100,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1822JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1822JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1823JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1823JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 768kB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1825JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.4-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1827JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC1830FBD144,551
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC1830FET100,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
cad-link
Manufacturer code: LPC1830FET180,551
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC1830FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Application Processors & System-on-Chip (SoC); LPC1830FET256K; NXP SEMICONDUCTORS
cad-link
Manufacturer code: LPC1830FET256K
Manufacturer: NXP
Quantity
pcs.
Net price
PLN/pcs.
1+ 86.45
10+ 75.59
50+ 67.72
100+ 62.65
450+ 55.03
For business clients only
450
delivery 4-10 days
Quantity per package: 450
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC1833FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC1833JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
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