Microcontrollers

Items per page:
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
cad-link
Manufacturer code: LPC4088FBD208,551
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA208
cad-link
Manufacturer code: LPC4088FET208,551
Manufacturer: NXP
Quantity per package: 160
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4310FET100,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC4312JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4312JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC4313JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC4317JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC4320FBD144,551
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4320FET100,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC4322JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4322JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC4323JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC4327JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 264kB SRAM; 204MHz; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC4330FBD144
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC4330FBD144,551
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4330FET100,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
cad-link
Manufacturer code: LPC4330FET180,551
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontroller; 16kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC4330FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC4333FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC4333JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4333JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC4337FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontrollers (MCU); LPC4337JBD144E; NXP SEMICONDUCTORS; 136 kB; 204 MHz; 83; 1 MB
cad-link
Manufacturer code: LPC4337JBD144E
Manufacturer: NXP
Quantity
pcs.
Net price
PLN/pcs.
1+ 113.64
10+ 99.33
25+ 90.39
60+ 83.93
120+ 78.33
360+ 70.40
Quantity per package: 60
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4337JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
cad-link
Manufacturer code: LPC4337JET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 128kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC4350FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; LQFP208
cad-link
Manufacturer code: LPC4353JBD208E
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC4357FET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontrollers (MCU); LPC4357JBD208K; NXP SEMICONDUCTORS
cad-link
Manufacturer code: LPC4357JBD208K
Manufacturer: NXP
Quantity
pcs.
Net price
PLN/pcs.
1+ 127.79
10+ 107.23
25+ 94.33
100+ 80.98
For business clients only
681
delivery 4-10 days
Quantity per package: 180
Type of packaging: reel
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
cad-link
Manufacturer code: LPC4357JET256,551
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC4370FET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
cad-link
Manufacturer code: LPC4370FET256E
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
cad-link
Manufacturer code: LPC43S20FBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC43S30FET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
cad-link
Manufacturer code: LPC43S37JBD144E
Manufacturer: NXP
Quantity per package: 300
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC43S37JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
cad-link
Manufacturer code: LPC43S50FET180E
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontrollers (MCU); LPC43S57JET256E; NXP SEMICONDUCTORS; 136 kB; 204 MHz; 164; 1 MB
cad-link
Manufacturer code: LPC43S57JET256E
Manufacturer: NXP
Quantity
pcs.
Net price
PLN/pcs.
1+ 113.68
10+ 99.36
25+ 92.52
100+ 84.25
Quantity per package: 90
Type of packaging: tray
Microcontroller; 1MB Flash; 32bit; -40+105 deg.C; LBGA256
cad-link
Manufacturer code: LPC43S67JET256E
Manufacturer: NXP
Quantity per package: 260
Type of packaging: tray
Microcontroller; 128kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
cad-link
Manufacturer code: LPC43S70FET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontrollers (MCU); LPC51U68JBD64EL; NXP SEMICONDUCTORS
cad-link
Manufacturer code: LPC51U68JBD64EL
Manufacturer: NXP
Quantity
pcs.
Net price
PLN/pcs.
1+ 25.78
10+ 22.18
30+ 19.47
50+ 18.54
100+ 16.31
Quantity per package: 800
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; -40+105 deg.C; LQFP64
cad-link
Manufacturer code: LPC51U68JBD64QL
Manufacturer: NXP
Quantity per package: 160
Type of packaging: tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP100
cad-link
Manufacturer code: LPC54005JBD100E
Manufacturer: NXP
Quantity per package: 450
Type of packaging: tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA100
cad-link
Manufacturer code: LPC54005JET100E
Manufacturer: NXP
Quantity per package: 1300
Type of packaging: tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP100
cad-link
Manufacturer code: LPC54016JBD100E
Manufacturer: NXP
Quantity per package: 450
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP208
cad-link
Manufacturer code: LPC54016JBD208E
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA180
cad-link
Manufacturer code: LPC54016JET180E
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP208
cad-link
Manufacturer code: LPC54018JBD208E
Manufacturer: NXP
Quantity per package: 120
Type of packaging: tray
Microcontroller; 32kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA180
cad-link
Manufacturer code: LPC54018JET180E
Manufacturer: NXP
Quantity per package: 189
Type of packaging: tray
Microcontroller; 256kB Flash; 32bit; Vin 1.62-3.6V; -40+105 deg.C; LQFP64
cad-link
Manufacturer code: LPC54101J256BD64QL
Manufacturer: NXP
Quantity per package: 160
Type of packaging: tray
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