Microcontrollers
Items per page:
Microcontroller; 512kB Flash; 32bit; Vin 2.4-3.6V; -40+85 deg.C; LQFP208
Manufacturer code: LPC4088FBD208,551
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+85 deg.C; TFBGA208
Manufacturer code: LPC4088FET208,551
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4310FET100,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4312JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4312JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4313JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4317JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4320FBD144,551
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4320FET100,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4322JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4322JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4323JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4327JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 264kB SRAM; 204MHz; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4330FBD144
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC4330FBD144,551
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4330FET100,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 8kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
Manufacturer code: LPC4330FET180,551
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 16kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4330FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4333FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC4333JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4333JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4337FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontrollers (MCU); LPC4337JBD144E; NXP SEMICONDUCTORS; 136 kB; 204 MHz; 83; 1 MB
Manufacturer code: LPC4337JBD144E
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 113.64 |
| 10+ | 99.33 |
| 25+ | 90.39 |
| 60+ | 83.93 |
| 120+ | 78.33 |
| 360+ | 70.40 |
Quantity per package:
60
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC4337JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC4337JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4350FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 512kB Flash; 32bit; -40+105 deg.C; LQFP208
Manufacturer code: LPC4353JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4357FET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontrollers (MCU); LPC4357JBD208K; NXP SEMICONDUCTORS
Manufacturer code: LPC4357JBD208K
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 127.79 |
| 10+ | 107.23 |
| 25+ | 94.33 |
| 100+ | 80.98 |
Quantity per package:
180
Type of packaging:
reel
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LBGA256
Manufacturer code: LPC4357JET256,551
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC4370FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LBGA256
Manufacturer code: LPC4370FET256E
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; LQFP144
Manufacturer code: LPC43S20FBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC43S30FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; LQFP144
Manufacturer code: LPC43S37JBD144E
Manufacturer: NXP
Quantity per package:
300
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; Vin 2.2-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC43S37JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 32kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA180
Manufacturer code: LPC43S50FET180E
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontrollers (MCU); LPC43S57JET256E; NXP SEMICONDUCTORS; 136 kB; 204 MHz; 164; 1 MB
Manufacturer code: LPC43S57JET256E
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 113.68 |
| 10+ | 99.36 |
| 25+ | 92.52 |
| 100+ | 84.25 |
Quantity per package:
90
Type of packaging:
tray
Microcontroller; 1MB Flash; 32bit; -40+105 deg.C; LBGA256
Manufacturer code: LPC43S67JET256E
Manufacturer: NXP
Quantity per package:
260
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 2.2-3.6V; -40+85 deg.C; TFBGA100
Manufacturer code: LPC43S70FET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontrollers (MCU); LPC51U68JBD64EL; NXP SEMICONDUCTORS
Manufacturer code: LPC51U68JBD64EL
Manufacturer: NXP
|
Quantity pcs. |
Net price PLN/pcs. |
|---|---|
| 1+ | 25.78 |
| 10+ | 22.18 |
| 30+ | 19.47 |
| 50+ | 18.54 |
| 100+ | 16.31 |
Quantity per package:
800
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; -40+105 deg.C; LQFP64
Manufacturer code: LPC51U68JBD64QL
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP100
Manufacturer code: LPC54005JBD100E
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA100
Manufacturer code: LPC54005JET100E
Manufacturer: NXP
Quantity per package:
1300
Type of packaging:
tray
Microcontroller; 128kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP100
Manufacturer code: LPC54016JBD100E
Manufacturer: NXP
Quantity per package:
450
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP208
Manufacturer code: LPC54016JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA180
Manufacturer code: LPC54016JET180E
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 64kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; LQFP208
Manufacturer code: LPC54018JBD208E
Manufacturer: NXP
Quantity per package:
120
Type of packaging:
tray
Microcontroller; 32kB SRAM; 32bit; Vin 1.71-3.6V; -40+105 deg.C; TFBGA180
Manufacturer code: LPC54018JET180E
Manufacturer: NXP
Quantity per package:
189
Type of packaging:
tray
Microcontroller; 256kB Flash; 32bit; Vin 1.62-3.6V; -40+105 deg.C; LQFP64
Manufacturer code: LPC54101J256BD64QL
Manufacturer: NXP
Quantity per package:
160
Type of packaging:
tray