Items per page:
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 32kB; SRAM 6kB; COMP; 1.8-3.6V; -40+85deg.C; LGA20
Package: reel
Quantity per package: 3000
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 64kB; SRAM 8kB; COMP; 1.8-3.6V; -40+85deg.C; TSSOP20
Package: reel
Quantity per package: 3000
Microcontroller GD32E230F; 32bit ARM CortexM23; 72MHz; FLASH 64kB; SRAM 8kB; COMP; 1.8-3.6V; -40+85deg.C; TSSOP20
Package: reel
Quantity per package: 3000
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 64kB; SRAM 8kB; COMP; 1.8-3.6V; -40+85deg.C; LGA20
Package: reel
Quantity per package: 3000
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 16kB; SRAM 4kB; COMP; 1.8-3.6V; -40+85deg.C; QFN28
Package: reel
Quantity per package: 3000
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 32kB; SRAM 6kB; COMP; 1.8-3.6V; -40+85deg.C; QFN28
Package: reel
Quantity per package: 3000
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 64kB; SRAM 8kB; COMP; 1.8-3.6V; -40+85deg.C; QFN28
Package: reel
Quantity per package: 3000
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 16kB; SRAM 4kB; COMP; 1.8-3.6V; -40+85deg.C; LQFP32
Package: tray
Quantity per package: 1500
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 16kB; SRAM 4kB; COMP; 1.8-3.6V; -40+85deg.C; QFN32
Package: tray
Quantity per package: 2940
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 32kB; SRAM 6kB; COMP; 1.8-3.6V; -40+85deg.C; LQFP32
Package: tray
Quantity per package: 1500
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 32kB; SRAM 6kB; COMP; 1.8-3.6V; -40+85deg.C; QFN32
Package: tray
Quantity per package: 2940
Microcontroller GD32E230; 32bit ARM CortexM23; 72MHz; FLASH 64kB; SRAM 8kB; COMP; 1.8-3.6V; -40+85deg.C; LQFP32
Package: tray
Quantity per package: 1500