Micro-ATXCOM ExpressCarrier Board; VGA/ LVDS/ AudioInterface; 1CF; 1 PCI; 2 PCIex1; 1 PCIex16; 4 SATA; 2COM; 8 USB; 8-bit GPIO; ExpressCard/ 54mm

COM ExpressCarrier Board type 6

Mini ITX COM Express Type10 Carrier Board

Micro ATX Type6 COM Express Carrier Board

Micro-ATX XTXCarrier Board; VGA/ LVDS/ Audio Interface; 2 PCI; 1 PCIex4;1 PCIex1; 1 ExpressCard/ 54; 1 Mini PCIe Slot; 1CF; 1 LPT; 2COM; 6 USB; 16-bit GPIO

Aluminum Electrolytic Capacitors - SMD; PANASONIC; EEV-FK1C332M; 3.3 mF; 20 %; 16 V; 1.8 A

Aluminum Electrolytic Capacitors - SMD; PANASONIC; EEV-FK1H102M; 1 mF; 20 %; 50 V; 1.61 A

Aluminum Electrolytic Capacitors - SMD; PANASONIC; EEV-FK1J221Q; 220 µF; 20 %; 63 V; 800 mA

3.5" QsevenCarrier Board; HDMI; LVDS; SDVO; Audio; 3xCOM; 6x USB; 2x SATA; 16-bit GPIO; 1x mPCIe; SIM slot; SD slot; PS/2; IrDA; operating temperature: 0+60C

Fan; DC; 12VDC; 50x50x10mm; 0.32m3/min; 30.0dB.

8-bit Microcontrollers - MCU 8051 50 MHz 16 kB flash 2.25 kB RAM 8-bit Busy Bee MCU; QFN-20

Gearbox; holding torque 9-18Nm; 2000RPM; 96%; gear ratio 5; fi42x56mm

Multiprotocol Modules; QUECTEL; EG21GGB-128-SGNS; 2.6 mm; I2C, UART, USB; 3.3 V - 4.3 V

Gearbox; holding torque 25-50Nm; 2000RPM; 94%; gear ratio 50; fi58.89.5mm

Gearbox; holding torque 28-56Nm; 2000RPM; 96%; gear ratio 5; fi58x73.5mm

Gearbox; holding torque 90-180Nm; 2000RPM; 96%; gear ratio 5; fi25x110mm

Expansion board M.2 -> single isolated CANbus; oper. temperature: -40+85 deg.C

Expansion board M.2 -> dual Isolated CANbus; oper. temperature: 0+70 deg.C

Expansion board M.2 -> four isolated CANbus; oper. temperature: -40+85 deg.C

Expansion board M.2 -> single 2.5GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single isolated 2.5GbE LAN ; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single Isolated 2.5GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single Isolated 2.5GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> 2 isolated porty LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual Isolated 2.5GbE LAN Module; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual Isolated 2.5GbE LAN Module; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single GbE LAN Module ;oper. temperature: 0+70 deg.C

Expansion board M.2 -> single isolated GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single isolated GbE LAN ; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single isolated GbE LAN ; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single isolated GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single isolated GbE LAN ; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual isolated GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual PoE Modul; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual PoE module; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual PoE+ module; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual isolated GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual isolated GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual isolated GbE LAN; oper. temperature: 0+70 deg.C

Expansion board M.2 -> single 10GbE LAN; oper. temperature: 0+55 deg.C

Expansion board M.2 -> single 10GbE LAN Module; oper. temperature: -20+55 deg.C

Expansion board M.2 -> dual USB 3.0 Module; oper. temperature: 0+70 deg.C

Expansion board M.2 -> dual USB 3.0 Module; oper. temperature: 0+70 deg.C

Expansion board M.2 -> LVDS or HDMI (DVI); oper. temperature -40+85 deg.C

Gearbox; holding torque 1-2Nm; 2000RPM; 96%; gear ratio 10; fi28x33mm

Expansion board M.2 -> dual SATA III RAID Module; oper. temperature: 0+70 deg.C

Electrolytic capacitor; 1mF; 10V; 20%; -40-105dg.C; 10x16; r5mm; 6000h