MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: rectangle 25x80mm, pad cover: gold; for XP leds, /10

MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: diameter 25mm, pad cover: gold; for XP, /20

MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, white soldermask, legend color: gold, size: diameter 25mm, pad cover: gold; for XP, /15

MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: diameter 36mm, pad cover: gold; for XP leds, /20

MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: rectangle 155x25mm, pad cover: gold; for XP LEDs, /6

MCPCB, thickness: 2mm, number of layers - 1, white soldermask, legend color: colorless, size: rectangle 54x290mm, pad cover: gold; for XP/XT LEDs, /4

MCPCB, thermal conductivity 1.5W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: rectangle 25x30mm, pad cover: gold; for XP/XT LEDs, /15

MCPCB, thermal conductivity 1.5W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: diameter 70mm, pad cover: gold; for XP LEDs, /6

MCPCB, thermal conductivity 1.5W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: diameter 77mm, pad cover: gold; for XP LEDs, /6

MCPCB, thermal conductivity 1.5W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: diameter 36mm, pad cover: gold; for XP LEDs, /20

MCPCB, thermal conductivity 1.5W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: diameter 45mm, pad cover: gold; for XP/XT LEDs, /4

MCPCB, thermal conductivity 1.5W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: diameter 45mm, pad cover: gold; for XP/XT LEDs, /4

MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: star 22mm, pad cover: gold; for XQ LEDs, /24

MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, white soldermask, legend color: gold, size: star 22mm, pad cover: gold; for XQ LEDs, /24

MC-S064-0008

MC-S065-0026

Current Sensor IC; 100kHz; 3 V- 3.6V; -40°C-125°C; SOIC- 8 Pins; MSL 2

Evaluation Board MCU007-48-FT; ARM Cortex-M0; 32bit; Integrated programmer / debugger

Microcontroller MCU007; 32bit ARM CortexM0; 16MHz-24MHz; FLASH 20kB; SRAM 4KB; EEPROM 2KB; 2.2-5.5V; -40+85deg.C; LQFP48

Microcontroller MCU008; 32bit ARM CortexM0; 16MHz-24MHz; FLASH 20kB; SRAM 4KB; EEPROM 2KB; 2.2-5.5V; -40+85deg.C; TSSOP20

Evaluation Board MCU008-20-BB; ARM Cortex-M0; 32bit; Integrated programmer / debugger

Microcontroller MCU008; 32bit ARM CortexM0; 24MHz; FLASH 20kB; SRAM 4kB; EEPROM 2KB; 2.2-5.5V; -40+85deg.C; LQFP48

Transistor: P-MOSFET; unipolar; -100V; -18A; 110mohm; 70W; -55+1505 deg.C; SMD; DPAK-3 (TO-252-3)

Mini-DIN Connector; female; 9 contacts; right angle; shielded; for PCB

Mini-DIN Socket; female; 4 contacts; right angle; shielded; for PCB

Mini-DIN Socket; female; 8 contacts; right angle; shielded; for PCB

Male Plug, 9 pins, with cable screen, RoHS

Mini-DIN Plug; male; 6 pins; with cable screen

PCI Express / PCI Connectors; AMPHENOL; MDT420E01001; Gold, Nickel; Black; Gold; 500 mA

Standard edge card connectors; AMPHENOL; ME1005610101011; Gold, Nickel; 1.1 A; 9.3 mm; 56

Fan; 230VAC; 254x254x89mm; 16.98m3/min; 55.0dB.

Fanless medical panelComputer 15.6'' HD PCAP; Intel Atom Z3735F; 2GB RAM; 32Gb eMMC; IP65 front; LAN; 3x USB; micro-USB; NFC; Audio; 2x speaker; microphone; RFID/SCR module (optional); VESA mounting

Fanless medical panelComputer 18.5'' HD PCAP; Intel Atom Z3735F; 2GB RAM; 32Gb eMMC; IP65 front; LAN; 3x USB; micro-USB; NFC; Audio; 2x speaker; microphone; RFID/SCR module (optional); VESA mounting

Embedded computer; Intel Core i3/i5/i7; LGA1151; RAM up to 64GB; 2x 2.5" SATA; 2x CFast; DP; VGA; DVI-D; 6x USB 3.2; 6x COM; 3x LAN; Audio; 8x DO; 8x DI; 8x antenna(connect); 2x mini PCIe; 4x SIM; oper. temp. -40+70C; power supp. 9-48V DC; Win10 IOT

Display 7.8"; 1072x720 px; LoRaWAN; smart display; operating temperature +5+40 deg.C; IP30; battery powered 4xAA

Fanless Embedded computer; Intel Celeron J1900; RAM up to 8 GB; 2.5" SATA; CFast; DP; DVI-D; 5x USB; 2x COM; 2x LAN; Audio; 6x antenna(connector); 4x DIO; 2x mini PCIe; 2x SIM; oper. temp. -40+70C; power supply 9-48V DC

Fanless Embedded Computer; Intel Core i3/i5/i7; RAM up to 64 GB; 2.5" SATA; 2x CFast; VGA; DP; DVI-D; 8x USB; 6x COM; 3x LAN; Audio; 8x DIO; 4x mini PCIe; 4x SIM; oper. temp. -40+70C; power supply 9-48V DC

Fan filter; 120x120mm; grill.

Fan filter; 172x172mm; grill.

Fanless Embedded Computer; Intel Celeron J1900; RAM up to 8 GB; 2.5" SATA; CFast; DP; DVI-D; 5x USB; 6x COM; 2x LAN; Audio; 4x antenna(connector); 4x DIO; 2x mini PCIe; 2x SIM; oper. temp. -40+70C; power supply 9-48V DC

Fanless Embedded Computer; Intel Core i3/i5/i7; RAM up to 64 GB; 4x 2.5" SATA; 2x CFast; VGA; DP; DVI-D; 8x USB; 6x COM; 3x LAN; Audio; 8x DIO; 4x mini PCIe; 4x SIM; oper. temp. -40+70C; power supply 9-48V DC

Fuse SMD; 800mA, 250VAC; 2410

Bridge Rectifier; 1200V; 2x100A; double; -55+150 deg.C; SMD; SOT227

Cable connector for PCB; 4.20mm pitch; 2-pin [2x1]; THT mounting; male; angled; double row; 7A

Resettable Fuses – PPTC; BOURNS; MF-FSMF050X-2; 500 mA; 1 A; 40 A; 500 mW

Resettable Fuses – PPTC; BOURNS; MF-FSML100/8-2; 1 A; 2 A

Resettable Fuses – PPTC; BOURNS; MF-GSMF300/36X-2; 3 A; 5.2 A; 20 s; 1.6 mm

Resettable Fuses – PPTC; BOURNS; MF-LSMF185/33X-2; 1.85 A; 3.7 A; 40 A; 1.5 W

Resettable Fuses – PPTC; BOURNS; MF-LSMF260X-2; 2.6 A; 5.2 A; 20 A; 1.5 W

PTC resettable fuse SMD; 3A; 24VDC; 20A