Top Side Cooled (TSC) Technology in Wolfspeed Discrete Products

Top Side Cooled (TSC) technology is now available in Wolfspeed’s discrete products. It consists in dissipating heat through the top of the package rather than through the PCB. The device structure is “inverted,” enabling direct heat transfer to a heatsink. This solution is particularly well-suited for high power density applications (e.g., e-mobility, data centers, renewable energy systems).

Top Side Cooled (TSC) is not a single product but a platform for new package types, optimized for top-side cooling and primarily used in discrete SiC MOSFET transistors.

Currently, Wolfspeed’s portfolio includes two main TSC product families:

• U2

• the first TSC product line in Wolfspeed’s offering,
• serves as the foundation for the development of future TSC generations,
• used in industrial and power applications,

• TOLT (TO-Leaded Top-Side Cooled)

• the latest family based on Gen4 SiC MOSFET technology,
• designed for very high power density applications (e.g., AI data centers),
• enables the design of more compact and efficient systems with effective heat dissipation.

TSC transistors are available in 650 V and 1200 V (automotive-grade) versions, used in applications such as EV chargers and DC/DC converters.

Key Advantages of Top Side Cooled Technology:

• Improved cooling

• lower thermal resistance of the entire system,
• higher power dissipation capability and more stable operation.

• Higher power density

• enables designing more compact and efficient devices,
• shorter thermal path = higher efficiency.

• Greater design flexibility

• no need to use the bottom side of the PCB for cooling,
• allows layout optimization and miniaturization.

• Higher reliability

• reduced thermal stress,
• advanced interconnections (e.g., clip, sintering) improve mechanical durability.

• Efficient manufacturing

• compatible with automated assembly processes,
• reduced overall system costs.

Design and Technological Aspects:

• Advanced interconnects (e.g., top-side clip), resulting in lower inductance and resistance, as well as improved thermal and electrical performance;
• Joining technologies (e.g., silver sintering) ensuring high thermal conductivity and resistance to thermal cycling;
• Integration of sensors (e.g., NTC) and cooling solutions within the module;
• Optimized creepage distances (e.g., 4.1 mm / 4.83 mm) – approx. 10% improvement compared to standard solutions;
• Pin and package design reduces the risk of insulation damage during assembly.

Benefits for Designers:

• High reliability supported by eliminating weak points (e.g., solder joints in some solutions) and maintaining parameter stability over long lifetimes;
• Higher energy efficiency (lower losses and operating costs);
• System miniaturization, providing a competitive advantage in space-constrained designs;
• Increased durability, resulting in lower failure risk and reduced service costs;
• Ready for future market requirements (AI, e-mobility, renewable energy).

 

Summary:

• Top Side Cooled is a modern approach to thermal management in SiC devices.
• It combines high performance, reliability, and compliance with safety requirements.
• It provides a solid foundation for next-generation high-power, compact designs.

 

Availability:
The C4MS065120U2-TR transistors are already available in the Maritex’ warehouse.

The following models will be available soon: C4MS025120U2-TR, C4MS036120U2-TR and C4MS047120U2-TR.

 

Please feel free to call us and submit your orders: +4858 662 05 28, [email protected]